Deposition

Manufacturing of a semiconductor component is a very complex process, involving many steps under vacuum. The deposition process is one of them and consists of depositing a material on the wafer through several technologies: PVD (Physical Vapor Deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition), SACVD (Sub-Atmospheric Chemical Vapor Deposition), LPCVD (Low Pressure Chemical Vapor Deposition) or more recently ALD (Atomic Layer Deposition). Each technology requires a different level of vacuum. We provide high vacuum turbo pumps and primary dry pumps solutions dedicated to your deposition applications and designed for the lowest cost of ownership and highest process lifetime.